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298d, 298w www.vishay.com vishay sprague revision: 11-jul-13 1 document number: 40065 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum chip capacitors m icrotan ? leadframeless molded features ? small sizes include 0603 and 0402 footprint ? lead (pb)-free l-shaped face-down terminations ? 8 mm tape and reel packaging available per eia-481 and reeling per iec 60286-3 ? 7" [178 mm] standard ? mounting: surface mount ? material categorization: ? for definitions of compliance please see www.vishay.com/doc?99912 performance characteristics operating temperature: 298d: - 55 c to + 125 c ? (above 85 c, voltage derating is required) 298w: - 55 c to + 125 c ? (above 40 c, voltage derating is required) capacitance range: 298d: 0.68 f to 220 f 298w: 2.2 f to 220 f capacitance tolerance: 20 % standard, 10 % available voltage range: 2.5 v dc to 50 v dc note ? preferred tolerance and reel sizes are in bold. ? we reserve the right to supply higher voltage ratings and tighter capacitance tolerance capacitors in the same case size. ? voltage substitutions will be marked with the higher voltage rating. ordering information 298d 335 x0 010 m 2 t type capacitance capacitance tolerance dc voltage rating case code termination reel size and packaging 298d 298w this is expressed in picofarads. the first two digits are the significant figures. the third is the number of zeros to follow. x0 = 20 % x9 = 10 % this is expressed in volts. to complete the three-digit block, zeros precede the voltage rating. a decimal point is indicated by an r (6r3 = 6.3 v). see ratings and case codes table 2 = 100 % tin 4 = gold plated t = tape and reel 7" [178 mm] reel dimensions in inches [millimeters] case code l w h (max.) p1 p2 (ref.) c k 0.039 + 0.008 [1.0 + 0.2] 0.020 + 0.008 [0.5 + 0.2] 0.024 [0.6] 0.01 0.004 [0.25 0.1] 0.02 [0.5] 0.015 0.004 [0.38 0.1] m 0.063 0.008 [1.60 0.2] 0.033 0.008 [0.85 0.2] 0.035 [0.9] 0.020 0.004 [0.50 0.1] 0.024 [0.60] 0.024 0.004 [0.60 0.1] s 0.079 0.008 [2.00 0.20] 0.050 0.008 [1.25 0.20] 0.035 [0.9] 0.020 0.004 [0.50 0.10] 0.040 [1.00] 0.035 0.004] [0.90 0.10] r 0.081 0.006 [2.06 0.15] 0.053 0.006 [1.35 0.15] 0.062 [1.57] 0.020 0.004 [0.51 0.1] 0.043 [1.1] 0.035 0.004 [0.90 0.1] p 0.094 0.004 [2.4 0.1] 0.057 0.004 [1.45 0.1] 0.047 [1.2] 0.020 0.004 [0.50 0.1] 0.057 [1.40] 0.035 0.004 [0.90 0.1] q 0.126 0.008 [3.2 0.2] 0.063 0.008 [1.6 0.2] 0.039 [1.0] 0.031 0.004 [0.80 0.1] 0.063 [1.60] 0.047 0.004 [1.20 0.1] a 0.126 0.008 [3.2 0.2] 0.063 0.008 [1.6 0.2] 0.071 [1.8] 0.031 0.004 [0.80 0.1] 0.063 [1.60] 0.047 0.004 [1.20 0.1] b 0.138 0.008 [3.5 0.2] 0.112 0.008 [2.8 0.2] 0.08 [2.0] 0.031 0.008 [0.80 0.2] 0.077 [1.95] 0.094 0.004 [2.4 0.1] l anode polarity bar anode termination h w p1 c p2 p1 cathode termination
298d, 298w www.vishay.com vishay sprague revision: 11-jul-13 2 document number: 40065 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) preliminary values, contact factory for availability. ratings and case codes f 2.5 v 4 v 6.3 v 10 v 16 v 20 v 25 v 35 v 50 v 298d 298d 298w 298d 298w 298d 298w 298d 298w 298d 298d 298d 298d 0.68 mm 1.0 k k/m k/m s m/r/s p 1.5 m 2.2 k/m k/m m k (1) p 3.3 m m 4.7 k m m/p k (1) m/p p p 10 k/m m/s k m r a 15 k m m 22 k k/m m m 33 m m p m (1) 47 m m r/p/a m (1) p 100 p m (1) p/a q 220 p p/q q marking voltage code capacitance code vcodecap, fcode 2.5 e 0.68 w 4.0 g 1.0 a 6.3 j 2.2 j 10 a 3.3 n 16 c 4.7 s 20 d 6.8 w 25 e 10 ? 35 v 15 e 50 t 22 j 33 n 47 s 68 w 100 a 150 e 220 j m-case voltage code a polarity bar k-case b-case 330 4 2 voltage vishay logo capacitance polarity bar p, r, s-case a, q-case capacitance code j g voltage code polarity bar eia capacitance code (pf) 107 j voltage code polarity bar
298d, 298w www.vishay.com vishay sprague revision: 11-jul-13 3 document number: 40065 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 standard ratings capacitance (f) case code part number max. dcl at + 25 c (a) max. df at + 25 c (%) max. esr at + 25 c 100 khz ( ? ) max. ripple 100 khz i rms (a) 2.5 v dc at + 85 c; 1.6 v dc at + 125 c 22 k 298d226x02r5k(2)t 10 40 20.00 0.027 47 m 298d476x02r5m(2)t 2.4 20 4.00 0.080 220 p 298d227x02r5p(2)t 11 30 3.00 0.122 298d: 4 v dc at + 85 c; 2.7 v dc at + 125 c 298w: 4 v dc at + 40 c; 2.5 v dc at + 85 c; 1.6 v dc at + 125 c 4.7 k 298d475x0004k(2)t 0.5 15 20.00 0.027 10 k 298d106x0004k(2)t 4.0 50 20.00 0.027 10 m 298d106(1)004m(2)t 0.5 8 5.00 0.071 15 k 298d156x0004k(2)t 10 50 20.00 0.027 22 k 298d226x0004k(2)t 25 40 20.00 0.027 22 m 298d226x0004m(2)t 0.9 15 4.00 0.080 33 m 298d336x0004m(2)t 2.6 30 4.00 0.080 47 m 298d476x0004m(2)t 3.8 40 7.50 0.080 100 p 298d107x0004p(2)t 4.0 30 2.00 0.100 100 m (1) 298w107x0004m2t 110 60 15.00 0.041 220 p 298d227(1)004p(2)t 17.6 30 3.00 0.122 220 q 298d227x0004q(2)t 88 80 15.00 0.061 220 q 298w227x0004q(2)t 88 80 15.00 0.061 298d: 6.3 v dc at + 85 c; 4 v dc at + 125 c 298w: 6.3 v dc at + 40 c; 4.0 v dc + 85 c; 2.5 v dc at + 125 c 1.0 k 298d105x06r3k(2)t 0.5 6 20.00 0.027 2.2 k 298d225x06r3k(2)t 0.5 8 20.00 0.027 2.2 m 298d225(1)6r3m(2)t 0.5 10 5.00 0.070 3.3 m 298d335(1)6r3m(2)t 0.5 8 6.00 0.090 4.7 m 298d475(1)6r3m(2)t 0.5 8 3.00 0.090 10 m 298d106x06r3m(2)t 0.6 8 5.00 0.071 10 s 298d106x06r3s(2)t 0.6 8 5.00 0.084 10 k 298w106x06r3k2t 10 30 15.00 0.032 15 m 298d156x06r3m(2)t 1.0 20 7.00 0.060 22 m 298d226x06r3m(2)t 2.8 20 5.50 0.067 33 m 298d336x06r3m(2)t 4.2 30 7.50 0.058 47 m (1) 298w476(1)6r3m(2)t 29.6 45 10.00 0.050 47 r 298d476x06r3r2t 3.0 25 3.00 0.122 47 p 298d476x06r3p(2)t 3.0 22 3.00 0.122 47 a 298d476x06r3a(2)t 3.0 10 2.00 0.150 100 p 298d107x06r3p(2)t 6.3 30 2.00 0.150 100 a 298d107x06r3a(2)t 6.3 20 1.00 0.270 notes ? part number definitions: (1) tolerance: for 10 % tolera nce, specify x9; for 20 % tolerance, change to x0 (2) termination: for 100 % tin specif y 2, for gold plated specify 4 (1) rating in development, contact factory for availability
298d, 298w www.vishay.com vishay sprague revision: 11-jul-13 4 document number: 40065 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 298d: 10 v dc at + 85 c; 7 v dc at + 125 c 298w: 10 v dc at + 40 c; 6.3 v dc + 85 c; 4.0 v dc at + 125 c 1.0 k 298d105x0010k(2)t 0.5 6 20.00 0.027 1.0 m 298d105(1)010m(2)t 0.5 6 12.00 0.045 1.5 m 298d155(1)010m(2)t 0.5 6 14.00 0.040 2.2 k 298d225x0010k(2)t 2.2 8 15.00 0.027 2.2 m 298d225x0010m(2)t 0.5 10 10.00 0.050 3.3 m 298d335(1)010m(2)t 0.5 8 6.00 0.090 4.7 k (1) 298w475(1)010k(2)t 4.7 50 50.00 0.017 4.7 m 298d475(1)010m(2)t 0.5 6 5.00 0.071 4.7 p 298d475(1)010p(2)t 0.5 6 4.00 0.106 10 m 298d106x0010m(2)t 1.0 20 7.50 0.058 15 m 298d156x0010m(2)t 1.5 30 7.50 0.058 22 m 298d226x0010m(2)t 22 40 10.00 0.050 33 m (1) 298w336(1)010m(2)t 66.0 75 21.00 0.035 33 p 298d336x0010p(2)t 3.3 20 4.00 0.150 47 p 298d476x0010p(2)t 4.7 22 3.00 0.122 100 q 298w107x0010q2t 100 50 15.00 0.060 298d: 16 v dc at + 85 c; 10 v dc at + 125 c 298w: 16 v dc at + 40 c; 10 v dc + 85 c; 8.2 v dc at + 125 c 1.0 k 298d105x0016k(2)t 1.6 10 20.00 0.027 1.0 m 298d105(1)016m(2)t 0.5 6 12.00 0.045 2.2 k (1) 298w225(1)016k(2)t 3.5 50 50.00 0.017 2.2 m 298d225(1)016m(2)t 0.5 10 12.00 0.045 4.7 m 298d475x0016m(2)t 0.8 12 12.00 0.046 4.7 p 298d475(1)016p(2)t 0.8 6 4.00 0.106 10 r 298d106(1)016r(2)t 1.6 8 8.00 0.075 20 v dc at + 85 c; 13 v dc at + 125 c 0.68 m 298d684(1)020m(2)t 0.5 6 20.00 0.042 1.0 s 298d105x0020s(2)t 0.5 6 10.00 0.059 4.7 p 298d475(1)020p(2)t 1.0 6 4.00 0.106 25 v dc at + 85 c; 17 v dc at + 125 c 0.68 m 298d684(1)025m(2)t 0.5 6 20.00 0.042 1.0 m 298d105(1)025m(2)t 0.5 6 10.00 0.050 1.0 s 298d105x0025s(2)t 0.5 6 10.00 0.059 1.0 r 298d105(1)025r(2)t 0.5 6 10.00 0.067 4.7 p 298d475(1)025p(2)t 1.2 6 4.00 0.106 10 a 298d106x0025a(2)t 2.5 10 3.50 0.146 35 v dc at + 85 c; 23 v dc at + 125 c 2.2 p 298d225x0035p(2)t 0.8 8 8.00 0.075 50 v dc at + 85 c; 33 v dc at + 125 c 1.0 p 298d105x0050p(2)t 0.5 8 8.00 0.075 standard ratings capacitance (f) case code part number max. dcl at + 25 c (a) max. df at + 25 c (%) max. esr at + 25 c 100 khz ( ? ) max. ripple 100 khz i rms (a) notes ? part number definitions: (1) tolerance: for 10 % tolera nce, specify x9; for 20 % tolerance, change to x0 (2) termination: for 100 % tin specif y 2, for gold plated specify 4 (1) rating in development, contact factory for availability
298d, 298w www.vishay.com vishay sprague revision: 11-jul-13 5 document number: 40065 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 recommended voltage derating (298d) + 85 c rating + 125 c rating working voltage (v) working voltage (v) 21.3 42.7 6.3 4 10 7 15 10 16 10 20 13 25 17 35 23 50 33 recommended voltage derating (298w) - 55 c/+ 40 c rating + 40 c/+ 85 c rating + 85 c/+ 125 c rating rated voltage (v) category voltage (v) category voltage (v) 42.51.6 6.342.5 10 6.3 4 16 10 6.3 20 13 8 25 17 10 35 23 14 298w voltage vs. temperature rating 120 100 100 % 80 60 40 20 0 40 % - 55 + 40 0 + 85 + 125 rated voltage (%) 80 % 33 % 63 % 80 % temperature (c) 100 % 100 % 80 % 50 % rated range recommended derating 298w recommended derating
298d, 298w www.vishay.com vishay sprague revision: 11-jul-13 6 document number: 40065 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note (1) preliminary values, contact factory for availability. guide to application 1. ac ripple current: the maximum allowable ripple current shall be determi ned from the formula: where, p = power dissipation in watts at + 25 c (see paragraph number 5 and the table power dissipation) r esr = the capacitor equivalent series resistance at the specified frequency 2. ac ripple voltage: the maximum allowable ripple voltage shall be determi ned from the formula: or, from the formula: where, p = power dissipation in watts at + 25 c (see paragraph number 5 and the table power dissipation) r esr = the capacitor equivalent series resistance at the specified frequency z = the capacitor impedance at the specified frequency 2.1 the sum of the peak ac voltage plus the applied dc voltage shall not exceed the dc voltage rating of the capacitor. 2.2 the sum of the negative peak ac voltage plus the applied dc voltage shall not allow a voltage reversal exceeding 10 % of the dc working voltage at + 25 c. 3. reverse voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the dc rating at + 25 c, 5 % of the dc rating at + 25 c, 5 % of the dc rating at + 85 c, and 1 % of the dc rating at + 125 c. 4. temperature derating: if these capacitors are to be operated at temperatures above + 25 c, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: 5. power dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. non-si nusoidal ripple current may produce heating effects which differ from those shown. it is important that the equivalent i rms value be established when calculating permissible operating levels. (power dissipation calculated using + 25 c temperature rise.) standard packaging quantity case code quantity (pcs/reel) 7" reel k 5000 m 4000 s 3000 r 2500 p 3000 q 2500 a 2000 b (1) 2000 power dissipation case code maximum permissible power dissipation at + 25 c (w) in free air k 0.015 m 0.025 s 0.035 r 0.045 p 0.045 q 0.055 a 0.075 i rms p r esr ------------ = v rms z p r esr ------------ = v rms i rms x z = temperature derating factor + 25 c 1.0 + 85 c 0.9 + 125 c 0.4
298d, 298w www.vishay.com vishay sprague revision: 11-jul-13 7 document number: 40065 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 6. printed circuit board materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina substrates, fr4, fr5, g10, ptfe-fluorocarbon and porcelanized steel). 7. attachment: 7.1 solder paste: the recommended thickness of the solder paste after application is 0.007" 0.001" [0.178 mm 0.025 mm]. care should be exercised in selecting the solder paste. the metal purity should be as high as practical. the flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. in practice this can be ai ded by extending the solder preheat time at temperatu res below the liquidous state of the solder. 7.2 soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. the soldering profile charts show recommended time/te mperature conditions for soldering. preheating is recommended. the recommended maximum ramp rate is 2 c per s. attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. the soldering iron must never come in contact with the capacitor. 7.2.1 backward and forwar d compatibility: capacitors with snpb or 100 % tin termination finishes can be soldered using snpb or lead (pb)-free soldering processes. 8. cleaning (flux removal) after soldering: molded capacitors are compatible with all commonly used solvents such as tes, tms, prelete, chlorethane, terpene and aqueous clea ning media. however, cfc/ods products are not used in the production of these devices and are no t recommended. solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 when using ultrasonic cleaning, the board may resonate if the output power is too high. this vibration can cause cracking or a decrease in the adherence of the termination. do not exceed 9w/l at 40 khz for 2 min. 9. recommended mounting pad geometries: proper mounting pad geometries are essential for successful solder connections. these dimensions are highly process sensitive and should be designed to minimize component re work due to unacceptable solder joints. the dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. these dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. product information micro guide www.vishay.com/doc?40115 pad dimensions packaging dimensions moisture sensitivity www.vishay.com/doc?40135 selector guides solid tantalum selector guide www.vishay.com/doc?49053 solid tantalum chip capacitors www.vishay.com/doc?40091 faq frequently asked questions www.vishay.com/doc?40110
typical performance characteristics www.vishay.com vishay sprague revision: 27-feb-13 21 document number: 40088 for technical ques tions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 typical performance characteristics tantalum capacitors notes ? all information presented in this document reflects typical performance characteristics (1) capacitance values 15 f and higher capacitor electrical performance characteristics item performance characteristics category temperature range - 55 c to + 85 c (to + 125 c with voltage derating) capacitance tolerance 20 %, 10 % (at 120 hz) 2 v rms (max.) at + 25 c using a capacitance bridge dissipation factor limit per standard ratings ta ble. tested via bridge method, at 25 c, 120 hz esr limit per standard ratings table. te sted via bridge method, at 25 c, 100 khz leakage current after application of rated voltage applied to capacitors for 5 min using a steady source of power with 1 k ? resistor in series with the capa citor under test, leakage current at 25 c is not more than 0.01 cv or 0.5 a, whichever is greater. note that the leakage current varies with temperature an d applied voltage. see graph below for the appropriate adjustment factor. capacitance change by temperature + 12 % max. (at + 125 c) + 10 % max. (at + 85 c) - 10 % max. (at - 55 c) for capacitance value > 300 f + 20 % max. (at + 125 c) + 15 % max. (at + 85 c) - 15 % max. (at - 55 c) reverse voltage capacitors are capable of withstanding peak voltages in the reverse direction equal to: 10 % of the dc rating at + 25 c 5 % of the dc rating at + 85 c vishay does not recommend in tentional or repetitive application of reverse voltage temperature derating if capacitors are to be used at temperatures above + 25 c, the permissible rms ripple current or voltage shall be calculated using the derating factors: 1.0 at + 25 c 0.9 at + 85 c 0.4 at + 125 c operating temperature + 85 c + 125 c rated voltage (v) surge voltage (v) rated voltage (v) surge voltage (v) 4 5.2 2.7 3.4 6.3 8 4 5 10 13 7 8 16 20 10 12 20 26 13 16 25 32 17 20 35 46 23 28 50 65 33 40 50 (1) 60 33 40 63 76 42 50
typical performance characteristics www.vishay.com vishay sprague revision: 27-feb-13 22 document number: 40088 for technical ques tions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? at + 25 c , the leakage current shall not exceed the value listed in the standard ratings table. ? at + 85 c , the leakage current shall not exceed 10 times the value listed in the standard ratings table. ? at + 125 c , the leakage current shall not exceed 12 times the value listed in the standard ratings table. typical leakage current factor range capacitor performance characteristics item performance characteristics surge voltage post application of surge voltage (as specified in the table above) in series with a 33 ? resistor at the rate of 30 s on, 30 s off, for 1000 successive test cycles at 85 c, capacito rs meet the characterist ics requirem ents listed below. capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less surge current after subjecting parts in series with a 1 ? resistor at the rate of 3 s charge , 3 s discharge, and a cap bank of 100k f for 3 successive test cycles at 25 c, capacitors meet the ch aracteristics requirem ents listed below. capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less life test at + 85 c capacitors meet the characteristic requirements listed below. after 2000 h application of rated voltage at 85 c. capacitance change leakage current within 10 % of initial value shall not exceed 125 % of initial value life test at + 125 c capacitors meet the characteristic requirements listed belo w. after 1000 h applicat ion 2/3 of rated voltag e at 125 c. capacitance change for parts with cap. ? 600 f for parts with cap. > 600 f leakage current within 10 % of initial value within 20 % of initial value shall not exceed 125 % of initial value leakage current factor percent of rated voltage 100 10 1.0 0.1 0.01 0.001 0 10 20 30 40 50 60 70 80 90 100 + 125 c + 85 c + 55 c + 25 c - 55 c + 150 c 0 c
typical performance characteristics www.vishay.com vishay sprague revision: 27-feb-13 23 document number: 40088 for technical ques tions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 capacitor environmental characteristics item condition environmental characteristics humidity tests at 40 c/90 % rh 1000 h, no voltage applied. capacitance change cap. ? 600 f cap. > 600 f dissipation factor within 10 % of initial value within 20 % of initial value not to exceed 150 % of initial + 25 c requirement temperature cycles at - 55 c/+ 125 c, 30 mi n each, for 5 cycles . capacitance change cap. ? 600 f cap. > 600 f dissipation factor leakage current within 10 % of initial value within 20 % of initial value initial specified value or less initial specified value or less moisture resistance mil-std-202, method 106 at rated voltage, 42 cycles. capacitance change cap. ? 600 f cap. > 600 f dissipation factor leakage current within 10 % of initial value within 20 % of initial value initial specified value or less initial specified value or less thermal shock capacitors are subjected to 5 cycles of the following: - 55 c (+ 0 c, - 5 c) for 30 min, then + 25 c (+ 10 c, - 5 c) for 5 min, then + 125 c (+ 3 c, - 0 c) for 30 min, then + 25 c (+ 10 c, - 5 c) for 5 min capacitance change cap. ? 600 f cap. > 600 f dissipation factor leakage current within 10 % of initial value within 20 % of initial value initial specified value or less initial specified value or less mechanical performance characteristics test condition condition post test performance shear test apply a pressure load of 5 n for 10 s 1 s horizontally to the center of capa citor side body. capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. substrate bend with parts soldered onto substrate test board, apply force to the test board for a deflection of 3 mm, for a total of 3 bends at a rate of 1 mm/s. capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less vibration mil-std-202, method 204, condition d, 10 hz to 2000 hz, 20 g peak capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. shock mil-std-202, method 213b shock (specified pulse), condition i, 100 g peak capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. resistance to solder heat ? recommended reflow profiles temperatures and durations are locate d within the capacitor series guides ? pb-free and lead-bearing series caps are backward and forward compatible capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. solderability mil-std-2002, method 208, ansi/j-std-002, test b. applies only to solder and tin plated terminations. does not apply to gold terminations. capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. resistance to solven ts mil-std-202, method 215 capacitance change dissipation factor leakage current within 10 % of initial value initial specified value or less initial specified value or less there shall be no mechanical or visual damage to capacitors post-conditioning. flammability encapsulent materi als meet ul 94 v-0 with an oxygen index of 32 %.
micro guide www.vishay.com vishay sprague revision: 11-jul-13 1 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide for leadframeless molded tantalum capacitors introduction tantalum electrolytic capacitors are the preferred choice in applications where volumetric efficiency, stable electrical parameters, high reliab ility, and long service life are primary considerations. the stability and resistance to elevated temperatures of the tantalum/tantalum oxide/manganese dioxide system make solid tantalum capacitors an appropriate choice for toda ys surface mount assembly technology. vishay sprague has been a pioneer and leader in this field, producing a large variety of tantalum capacitor types for consumer, industrial, automotive, military, and aerospace electronic applications. tantalum is not found in its pure state. rather, it is commonly found in a number of oxide minerals, often in combination with columbium ore. this combination is known as tantalite when its contents are more than one-half tantalum. important sources of tantalite include australia, brazil, canada, china, an d several african countries. synthetic tantalite concentrates produced from tin slags in thailand, malaysia, and brazil are also a significant raw ma terial for tantalum production. electronic applications, an d particularly capacitors, consume the largest share of world tantalum production. other important applications for tantalum include cutting tools (tantalum carbide), high temperature super alloys, chemical processing equipment, medical implants, and military ordnance. vishay sprague is a major user of tantalum materials in the form of powder and wire for capacitor elements and rod and sheet for high temperatu re vacuum processing. the basics of tantalum capacitors most metals form crystalline oxides which are non-protecting, such as rust on iron or black oxide on copper. a few metals form dens e, stable, tightly adhering, electrically insulating oxides. these are the so-called valve metals and include titanium, zi rconium, niobium, tantalum, hafnium, and aluminum. only a few of these permit the accurate control of oxide thickness by electrochemical means. of these, the most valuable for the electronics industry are aluminum and tantalum. capacitors are basic to all kinds of electrical equipment, from radios and television sets to missile controls and automobile ignitions. their function is to store an electrical charge for later use. capacitors consist of two co nducting surfaces, usually metal plates, whose function is to conduct electricity. they are separated by an insulating material or dielectric. the dielectric used in all tantalum electrolytic capacitors is tantalum pentoxide. tantalum pentoxide compound possesses high-dielectric strength and a high-dielectric constant. as capacitors are being manufactured, a film of tantalum pentox ide is applied to their electrodes by means of an electrolytic process. the film is applied in various thic knesses and at various voltages and although transparent to begin with, it takes on different colors as light refracts through it. this coloring occurs on the tantalum electrodes of all types of tantalum capacitors. rating for rating, tantalum capacitors tend to have as much as three times better capacitance/volume efficiency than aluminum electrolytic capacitors. an approximation of the capacitance/volume efficiency of other types of capacitors may be inferred from the following table, which shows the dielectric constant ranges of the various materials used in each type. note that tantalum pentoxide has a dielectric constant of 26, some three times greater than that of aluminum oxide. this, in addition to the fact that extremely thin films can be deposited du ring the electrolytic process mentioned earlier, makes the tantalum capacitor extremely efficient with respect to the number of microfarads available per unit volume. th e capacitance of any capacitor is determined by the su rface area of the two conducting plates, the distance between the plates, and the dielectric constant of the insulating material between the plates. in the tantalum electrolytic capacitor, the distance between the plates is very small since it is only the thickness of the tantalum pentoxide film. as the dielectric constant of the tantalum pentoxide is high, the capacitance of a tantalum capacitor is high if the area of the plates is large: ? where c= capacitance e = dielectric constant a = surface area of the dielectric t = thickness of the dielectric tantalum capacitors contain either liquid or solid electrolytes. in solid electrolyte capacitors, a dry material (manganese dioxide) forms the cathode plate. a tantalum lead is embedded in or welded to the pellet, which is in turn connected to a termination or lead wire. the drawings show the construction details of the surface mount types of tantalum capacitors sh own in this catalog. comparison of capacitor dielectric constants dielectric e dielectric constant air or vacuum 1.0 paper 2.0 to 6.0 plastic 2.1 to 6.0 mineral oil 2.2 to 2.3 silicone oil 2.7 to 2.8 quartz 3.8 to 4.4 glass 4.8 to 8.0 porcelain 5.1 to 5.9 mica 5.4 to 8.7 aluminum oxide 8.4 tantalum pentoxide 26 ceramic 12 to 400k c ea t ------ - =
micro guide www.vishay.com vishay sprague revision: 11-jul-13 2 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid electrolyte tantalum capacitors solid electrolyte capacitors contain manganese dioxide, which is formed on the tantalum pentoxide dielectric layer by impregnating the pellet with a solution of manganous nitrate. the pellet is then heated in an oven, and the manganous nitrate is converted to manganese dioxide. the pellet is next coated with graphite, followed by a layer of metallic silver, which provides a conductive surface between the pellet and the leadframe. molded chip tantalum capacitor encases the element in plastic resins, such as epoxy materials. afte r assembly, the capacitors are tested and inspected to assure long life and reliability. it offers excellent reliability and high stability for consumer and commercial el ectronics with the added feature of low cost. surface mount designs of so lid tantalum capacitors use lead frames or lead frameless designs as shown in the accompanying drawings. tantalum capacitors for all design considerations solid electrolyte designs are the least expensive for a given rating and are used in many applications where their very small size for a given unit of capacitance is of importance. they will typically withstand up to about 10 % of the rated dc working voltage in a revers e direction. also important are their good low temperature performance characteristics and freedom from corrosive electrolytes. vishay sprague patented the original solid electrolyte capacitors and was the first to market them in 1956. vishay sprague has the broadest line of tantalum capacitors and has continued its position of leadership in this field. data sheets covering the various types and styles of vishay sprague capacitors for consumer and entertainment electronics, industry, and milit ary applications are available where detailed performance characteristics must be specified. ? fig. 1 - leadframeless molded capacitors, all types s ide cathode termination (-) s intered tantalum pellet mno 2 /carbon/ s ilver coating bottom cathode termination (-) s ilver adhe s ive epoxy g la ss reinforced epoxy re s in bottom anode termination (+) s ide anode termination (+) polarity bar marking epoxy re s in encap s ulation voltage code excluding 0402 (1005 metric) ca s e s ize
micro guide www.vishay.com vishay sprague revision: 11-jul-13 3 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 solid tantalum capacitors - leadframeless molded series tl8 298w 298d tr8 product image type solid tantalum leadframeless molded chip capacitors features small size including 0603 and 0402 foot print ultra low profile standard industrial grade high performance, standard industrial grade low esr temperature range operating temperature: - 55 c to + 125 c (above 40 c, voltage de rating is required) operating temperature: - 55 c to + 125 c (above 85 c, voltage derating is required) capacitance range 0.68 f to 220 f 2.2 f to 220 f 0.68 f to 220 f 1 f to 220 f voltage range 4 v to 35 v 4 v to 16 v 2.5 v to 50 v 2.5 v to 25 v capacitance tolerance 20 %, 10 % dissipation factor 6 % to 80 % 30 % to 80 % 6 % to 80 % 6 % to 80 % case codes w0, w9, a0, b0 k, m, q k, m, r, p, q, a, s m, r, p, q, a termination 100 % tin 100 % tin or gold plated solid tantalum capacitors - leadframeless molded series tp8 tm8 dla 11020 product image type solid tantalum leadframeless molded chip capacitors features small size including 0603 and 0402 foot print high performance, automotive grade high reliability high reliability, dla approved temperature range operating temperature: - 55 c to + 125 c (above 85 c, voltage derating is required) capacitance range 1 f to 100 f 0.68 f to 47 f 1 f to 47 f voltage range 6.3 v to 40 v 2 v to 40 v 6.3 v to 40 v capacitance tolerance 20 %, 10 % dissipation factor 6 % to 30 % 6 % to 20 % 6 % to 8 % case codes m, p, a, b, w, r k, m, w, r, p, a, n, t m, w, r, p, a, n, t termination 100 % tin or gold plated tin/lead solder plated or 100 % tin tin/lead solder plated or gold plated
micro guide www.vishay.com vishay sprague revision: 11-jul-13 4 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? metric dimensions will govern . dimensions in inches are rounded and for reference only. (1) a 0 , b 0 , k 0 , are determined by the maximum dimensions to the ends of the termin als extending from the compon ent body and/or the body dimensions of the component. the clearance between the ends of the terminals or body of the co mponent to the sides and depth of the cavity (a 0 , b 0 , k 0 ) must be within 0.002" (0.05 mm) minimum and 0.020" (0. 50 mm) maximum. the clearance allo wed must also prevent rotation of the component within the cavity of not more than 20. (2) tape with components shall pass around radius r without damage . the minimum trailer length may require additional length to p rovide r minimum for 12 mm embossed tape for reels with hub diameters approaching n minimum. (3) this dimension is the flat area from the edge of the sprocket hole to either outward deformatio n of the carrier tape between th e embossed cavities or to the edge of the cavity whichever is less. (4) this dimension is the flat area from the edge of the carrier ta pe opposite the sprocket holes to either the outward deformation of the carrier tape between the embossed cav ity or to the edge of the cavity whichever is less. (5) the embossed hole location shall be measured from the sprocket hole controlling the location of the embossement. dimensions of embossement location shall be a pplied independent of each other. (6) b 1 dimension is a reference dimension tape feeder clearance only. notes (1) for reference only (2) packaging of m case in plastic tape is available per request plastic tape and reel packaging in inches [millimeters] tape and reel specifications: all case sizes are available on plastic embo ssed tape per eia-481. standard reel diameter is 7" [178 mm]. carrier tape dimensions in inches [millimeters] for 298d, 298w, tr8, tp8, tl8 case code tape size b 1 (max.) (1) d 1 (min.) f k 0 (max.) p 1 w m (2) 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] w 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0] r 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0] p 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0] a 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0] a0, q 8 mm - 0.02 [0.5] 0.138 [3.5] 0.049 [1.25] 0.157 [4.0] 0.315 [8.0] b 8 mm 0.157 [3.98] 0.039 [1.0] 0.138 [3.5] 0.091 [2.32] 0.157 [4.0] 0.315 [8.0] w0 8 mm 0.094 [2.40] 0.029 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0] w9, s 8 mm 0.126 [3.20] 0.029 [0.75] 0.138 [3.5] 0.045 [1.15] 0.157 [4.0] 0.315 [8.0] b0 12 mm 0.181 [4.61] 0.059 [1.5] 0.217 [5.5] 0.049 [1.25] 0.157 [4.0] 0.472 [12.0] 0.004 [0.10] max. k 0 tape thickness b 1 (max.) (6) 0.014 [0.35] max. 10 pitches cumulative tolerance on tape 0.008 [0.200] embossment 0.069 0.004 [1.75 0.10] d 1 (min.) for components 0.079 x 0.047 [2.0 x 1.2] and larger (5) . maximum user direction of feed center lines of cavity a 0 p 1 f w 0.030 [0.75] min. (3) 0.030 [0.75] min. (4) 0.079 0.002 [2.0 0.05] 0.157 0.004 [4.0 0.10] 0.059 + 0.004 - 0.0 [1.5 + 0.10 - 0.0] b 0 maximum component rotation (side or front sectional view) 20 for tape feeder reference only including draft. concentric around b 0 (5) deformation between embossments to p cover tape top cover tape cavity size (1) cathode (-) anode (+) direction of feed 20 maximum component rotation typical component cavity center line typical component center line a 0 b 0 (top view) 0.9843 [250.0] tape 3.937 [100.0] 0.039 [1.0] max. 0.039 [1.0] max. camber allowable camber to be 0.039/3.937 [1/100] (top view) non-cumulative over 9.843 [250.0]
micro guide www.vishay.com vishay sprague revision: 11-jul-13 5 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes (1) for reference only note (1) a 0 , b 0 are determined by the maximum dimensions to the ends of the terminals e xtending from the componen t body and/or the body dimensions of the component. the clearance between the ends of the terminals or body of the co mponent to the sides and depth of the cavity (a 0 , b 0 ) must be within 0.002" (0.05 mm) minimum and 0.020" (0.50 mm) maximum. the clearan ce allowed must also prevent rotation of the component within the ca vity of not more than 20. carrier tape dimensions in inches [millimeters] for tm8 case code tape size b 1 (max.) (1) d 1 (min.) f k 0 (max.) p 1 w m 8 mm 0.075 [1.91] 0.02 [0.5] 0.138 [3.5] 0.043 [1.10] 0.157 [4.0] 0.315 [8.0] w 8 mm 0.112 [2.85] 0.039 [1.0] 0.138 [3.5] 0.053 [1.35] 0.157 [4.0] 0.315 [8.0] r 8 mm 0.098 [2.46] 0.039 [1.0] 0.138 [3.5] 0.066 [1.71] 0.157 [4.0] 0.315 [8.0] p 8 mm 0.108 [2.75] 0.02 [0.5] 0.138 [3.5] 0.054 [1.37] 0.157 [4.0] 0.315 [8.0] a 8 mm 0.153 [3.90] 0.039 [1.0] 0.138 [3.5] 0.078 [2.00] 0.157 [4.0] 0.315 [8.0] n 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.051 [1.30] 0.157 [4.0] 0.472 [12.0] t 12 mm 0.154 [3.90] 0.059 [1.5] 0.216 [5.5] 0.067 [1.70] 0.157 [4.0] 0.472 [12.0] paper tape and reel packaging in inches [millimeters] for 298d, 298w, tr8, tp8, tl8 case size tape size a 0 b 0 d 0 p 0 p 1 p 2 efwt k8 mm 0.033 0.002 [0.85 0.05] 0.053 0.002 [1.35 0.05] 0.06 0.004 [1.5 0.1] 0.157 0.004 [4.0 0.1] 0.078 0.004 [2.0 0.1] 0.079 0.002 [2.0 0.05] 0.069 0.004 [1.75 0.1] 0.0138 0.002 [3.5 0.05] 0.315 0.008 [8.0 0.2] 0.03 0.002 [0.75 0.05] m8 mm 0.041 0.002 [1.05 0.05] 0.071 0.002 [1.8 0.05] 0.06 0.004 [1.5 0.1] 0.157 0.004 [4.0 0.1] 0.157 0.004 [4.0 0.1] 0.079 0.002 [2.0 0.05] 0.069 0.004 [1.75 0.1] 0.0138 0.002 [3.5 0.05] 0.315 0.008 [8.0 0.2] 0.037 0.002 [0.95 0.05] ? d 0 t bottom cover tape f p 1 a 0 b 0 e 2 p 2 w p 0 e 1 cavity s ize (1) bottom cover tape u s er feed direction cavity center line s top cover tape [10 pitche s cumulative tolerance on tape 0.2 mm] g anode
micro guide www.vishay.com vishay sprague revision: 11-jul-13 6 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 note ? capacitors should withstand reflow profile as per j-std-020 standard recommended reflow profiles profile feature snpb eutectic assembly lead (pb)-free assembly preheat and soak temperature min. (t smin. ) 100 c 150 c temperature max. (t smax. ) 150 c 200 c time (t s ) from (t smin. to t smax. ) 60 s to 90 s 60 s to 150 s ramp up ramp-up rate (t l to t p ) 3 c/s maximum liquidous temperature (t l ) 183 c 217 c time (t l ) maintained above t l 60 s to 150 s peak package body temperature (t p ) max. 235 c 260 c time (t p ) within 5 c of the peak max. temperature 20 s 30 s ramp down ramp-down rate (t p to t l ) 6 c/s maximum time from 25 c to peak temper ature 6 min maximum 8 min maximum pad dimensions in inches [millimeters] case code a (min.) b (nom.) c (nom.) d (nom.) k 0.028 [0.70] 0.018 [0.45] 0.024 [0.60] 0.059 [1.50] m 0.039 [1.00 ] 0.028 [0.70] 0.024 [0.60] 0.080 [2.00] r, w, w0, w9, s 0.059 [1.50] 0.031 [0.80] 0.039 [1.00] 0.102 [2.60] p 0.063 [1.60] 0.031 [0.80] 0.047 [1.20] 0.110 [2.80] a, q, a0 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] t, n 0.071 [1.80] 0.067 [1.70] 0.053 [1.35] 0.187 [4.75] b, b0 0.118 [3.00] 0.071 [1.80] 0.065 [1.65] 0.207 [5.25] time temperature t s time 25 c to peak t p t p t l t smin. 25 t l t smax. preheat area max. ramp up rate = 3 c/s max. ramp down rate = 6 c/s a b c d
micro guide www.vishay.com vishay sprague revision: 11-jul-13 7 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 notes ? at + 25 c , the leakage current shall not exceed the value listed in the standard ratings table ? at + 85 c , the leakage current shall not exceed 10 times the value listed in the standard ratings table ? at + 125 c , the leakage current shall not exceed 12 times the value listed in the standard ratings table typical leakag e current factor range 100 10 1.0 0.1 0.01 0.001 010 40 708090 60 50 20 30 100 + 125 c + 85 c + 55 c + 25 c 0 c - 55 c percent of rated volta g e leaka g e current factor
micro guide www.vishay.com vishay sprague revision: 11-jul-13 8 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 typical curves at + 25 c, impedance and esr vs. frequency 1 10 100 0.1 1 10 100 1000 fre q uency, khz m ca s e 22 f - 4 v impedance e s r e s r/z, 0.1 1 10 100 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 47 f - 4 v impedance e s r 1 10 100 1000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 10 f - 6 v impedance e s r 0.1 1 10 100 1000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 4.7 f - 10 v impedance e s r 1 10 100 1000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 10 f - 10 v impedance e s r 1 10 100 1000 10 000 0.1 1 10 100 1000 fre q uency, khz e s r/z, m ca s e 1 f - 16 v impedance e s r
micro guide www.vishay.com vishay sprague revision: 11-jul-13 9 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 typical curves at + 25 c, impedance and esr vs. frequency 100.0 10.0 1.0 0.1 e s r/z, 0.1 1 10 100 1000 33 f - 10 v impedance e s r p ca s e fre q uency, khz 1000.0 100.0 10.0 1.0 0.1 0.1 1 10 100 1000 impedance e s r fre q uency, khz e s r/z, p ca s e 4.7 f - 25 v 100.0 1.0 10.0 0.1 0.1 1 10 100 1000 e s r/z, fre q uency, khz p ca s e impedance e s r 47 f - 10 v 10.0 1.0 0.1 0.1 1 10 100 1000 e s r/z, fre q uency, khz p ca s e 220 f - 4 v impedance e s r
micro guide www.vishay.com vishay sprague revision: 11-jul-13 10 document number: 40115 for technical questions, contact: tantalum@vishay.com this document is subject to change without notice. the products described herein and this document are subject to specific disclaimers, set forth at www.vishay.com/doc?91000 guide to application 1. ac ripple current: the maximum allowable ripple current shall be determi ned from the formula: where, p = power dissipation in watts at + 25 c (see paragraph number 5 and the table power dissipation) r esr = the capacitor equivalent series resistance at the specified frequency 2. ac ripple voltage: the maximum allowable ripple voltage shall be determi ned from the formula: or, from the formula: where, p = power dissipation in watts at + 25 c (see paragraph number 5 and the table power dissipation) r esr = the capacitor equivalent series resistance at the specified frequency z = the capacitor impedance at the specified frequency 2.1 the sum of the peak ac voltage plus the applied dc voltage shall not exceed the dc voltage rating of the capacitor. 2.2 the sum of the negative peak ac voltage plus the applied dc voltage shall not allow a voltage reversal exceeding 10 % of the dc working voltage at + 25 c. 3. reverse voltage: these capacitors are capable of withstanding peak voltages in the reverse direction equal to 10 % of the dc rating at + 25 c, 5 % of the dc rating at + 25 c, 5 % of the dc rating at + 85 c, and 1 % of the dc rating at + 125 c. 4. temperature derating: if these capacitors are to be operated at temperatures above + 25 c, the permissible rms ripple current or voltage shall be calculated using the derating factors as shown: 5. power dissipation: power dissipation will be affected by the heat sinking capability of the mounting surface. non-sinusoidal ripple current may produce heating effects which differ from those shown. it is important that the equivalent i rms value be established when calculating permissible operating levels. (power di ssipation calculated using + 25 c temperature rise.) 6. printed circuit board materials: molded capacitors are compatible with commonly used printed circuit board materials (alumina su bstrates, fr4, fr5, g10, ptfe-fluorocarbon and porcelanized steel). 7. attachment: 7.1 solder paste: the recommended thickness of the solder paste after applic ation is 0.007" 0.001" [0.178 mm 0.025 mm]. care should be exercised in selecting the solder paste. the metal purity should be as high as practical. the flux (in the paste) must be active enough to remove the oxides formed on the metallization prior to the exposure to soldering heat. in practice this can be aide d by extending the solder preheat time at temperatu res below the liquidous state of the solder. 7.2 soldering: capacitors can be attached by conventional soldering techniques; vapor phase, convection reflow, infrared reflow, wave soldering and hot plate methods. the soldering profile charts show recommended time/te mperature conditions for soldering. preheating is recommended. the recommended maximum ramp rate is 2 c per s. attachment with a soldering iron is not recommended due to the difficulty of controlling temperature and time at temperature. the soldering iron must never come in contact with the capacitor. 7.2.1 backward and forwar d compatibility: capacitors with snpb or 100 % tin termination finishes can be soldered using snpb or lead (pb)-free soldering processes. 8. cleaning (flux removal) after soldering: molded capacitors are compatible with all commonly used solvents such as tes, tms, prelete, chlorethane, terpene and aqueous clea ning media. however, cfc/ods products are not used in the production of these devices and are no t recommended. solvents containing methylene chloride or other epoxy solvents should be avoided since these will attack the epoxy encapsulation material. 8.1 when using ultrasonic cleaning, the board may resonate if the output power is too high. this vibration can cause cracking or a decrease in the adherence of the termination. do not exceed 9w/l at 40 khz for 2 min. 9. recommended mounting pad geometries: proper mounting pad geometries are essential for successful solder connections. these dimensions are highly process sensitive and should be designed to minimize component re work due to unacceptable solder joints. the dimensional configurations shown are the recommended pad geometries for both wave and reflow soldering techniques. these dimensions are intended to be a starting point for circuit board designers and may be fine tuned if necessary based upon the peculiarities of the soldering process and/or circuit board design. temperature derating factor + 25 c 1.0 + 85 c 0.9 + 125 c 0.4 i rms p r esr ------------ = v rms z p r esr ------------ = v rms i rms x z =
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